- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/3105 - After-treatment
Patent holdings for IPC class H01L 21/3105
Total number of patents in this class: 3146
10-year publication summary
|
306
|
414
|
456
|
400
|
496
|
452
|
288
|
172
|
178
|
29
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
768 |
| International Business Machines Corporation | 60644 |
180 |
| Applied Materials, Inc. | 16587 |
150 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
116 |
| Tokyo Electron Limited | 11599 |
112 |
| Samsung Electronics Co., Ltd. | 131630 |
86 |
| United Microelectronics Corp. | 3921 |
80 |
| Semiconductor Manufacturing International (Shanghai) Corporation | 1764 |
63 |
| Resonac Corporation | 2233 |
51 |
| Renesas Electronics Corporation | 6305 |
47 |
| Lam Research Corporation | 4775 |
46 |
| Fujimi Incorporated | 676 |
45 |
| Micron Technology, Inc. | 24960 |
42 |
| Kioxia Corporation | 9847 |
41 |
| CMC Materials LLC | 254 |
38 |
| Versum Materials US, LLC | 591 |
37 |
| Semiconductor Manufacturing International (Beijing) Corporation | 1019 |
35 |
| Intel Corporation | 45621 |
34 |
| Yangtze Memory Technologies Co., Ltd. | 1940 |
32 |
| Canon Inc. | 36841 |
29 |
| Other owners | 1114 |